Electronics Forum | Sat Mar 23 23:07:02 EDT 2013 | dhanish
I have a question on component placement 1)for solder paste ,do we need to press the component into solder paste during placement process? 2)how we define force for Smt component..sometimes we add force for certain BGA?any guideline? Pls advise
Electronics Forum | Wed Nov 24 06:24:52 EST 2004 | Joe
Hi, I am an Engineering student doing some research on the component/nozzle interface on SMT Pick and Place machines. Could anyone tell me the force at which the nozzle hits the component as it is picked from the feeder or the placement force on a
Electronics Forum | Thu Nov 30 23:48:16 EST 2000 | DL
Dave, Thanks for the input. I cant beleive I didnt think to check the suppliers web site, I feel like an... well anyhow. The leads I'm referring to are place at a 90 degree angle from the edge of the pcb and extend towards the bottom as opposed to
Electronics Forum | Fri Nov 25 15:52:40 EST 2011 | davef
"IPC-2221 - Generic Standard On Printed Board Design" talks to fiducials. Anther take on fiducials says they shall meet the following requirements. * Make fiducials 1 - 1.5 mm diameter circle. * Cover fiducials with tin. * Keep solder mask opening at
Electronics Forum | Tue Mar 13 18:13:41 EDT 2018 | dleeper
Placement force usually refers to the amount of force an SMT nozzle applies to a part when placing it. You want enough force to push the component onto the paste but not so much that you damage the part. Some specialized applications involve placing
Electronics Forum | Sun May 26 02:06:39 EDT 2019 | jlawson
Placement force can cause chip cracking-micro cracks also. As machines are getting faster they tend to not control force other than spring pressures and z displacements. There are some machines that have full closed loop place pressure control , but
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Tue Mar 03 03:02:17 EST 2009 | emmanueldavid
25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role for these defects. 4. Placement: P
Electronics Forum | Sun Nov 08 10:41:11 EST 2009 | rao
Excellent Web OEE calculator... For Ideal Cycle time we use to take Programming Cycle Time but in this calculator it seems you have taken Equipment Rated CPH. For a Given Board & the placement locations the rated CPH is not at all attainable because
Electronics Forum | Wed Jun 13 21:31:27 EDT 2001 | davef
Lotsa ways to bust caps. First: placement force; Second: thermal stress; Third: poor pad design. Forth: then, ummm maybe the cap supplier. Please describe the crack in more detail. Where does the crack start? Where does the crack go?
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