Electronics Forum | Thu Jun 12 11:12:08 EDT 2003 | babe
The last statement saying that seeing down the bga component with these systems is useless, is an incorrect statement. First with x-ray you do not see flux residue and or flux migration, second with x-ray you do not see a cold solder joint. Visual i
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
Electronics Forum | Thu Apr 10 09:28:14 EDT 2003 | chrissieneale
Thanks for your replies guys, there's some good info there. Dave, answers to your questions: The stencil was initially a big problem as with the Egineering Model's (EM's) and Engineering Qualifing model (EQM's) we kept getting short circuits due to
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