Electronics Forum | Fri Mar 21 09:08:53 EST 2003 | mantis
Hi all, I have a strange problem,while building a large 15x15inch 3.5mm thick Pcb.During topside reflow i am experiencing some misaligned parts and even bridging on a bga that are sitting very close to a D size tantalum cap.The strange thing is that
Electronics Forum | Fri Mar 21 09:49:33 EST 2003 | davef
Different vendor for: * Tants * BGA BGA correct?
Electronics Forum | Fri Mar 21 11:12:47 EST 2003 | dphilbrick
Change the vendor of what? The BGA, the Cap, the 0805?
Electronics Forum | Fri Mar 21 10:28:27 EST 2003 | mantis
Sorry i didnt explain it vey well,the parts that are misaligned are always sitting next to these particular tanatlum capacitors.It affects 0805 parts and A tsop36 and can even cause a short on a bga right in the corner where the tant sits.If you chan
Electronics Forum | Fri Mar 21 11:25:07 EST 2003 | jonfox
His subject line is "Tantalum caps causing misaligned parts". Come on guys, I think he answered the question already. Is there any via/traces that connects the pads of the TANT to the 0805 and the BGA. Your two parts may be physically the same, bu
Electronics Forum | Tue May 22 00:01:43 EDT 2001 | philipreyes
Hi to all!! For those who have current process of Placing BGA package (SMT using BGA package), do you have any idea what is the acceptable misalignment of the balls on the pads of PCB? I have here with me the IPC 7095 BGA Assembly and Design but
Electronics Forum | Fri Jun 17 23:31:12 EDT 2005 | kenscj
Hi all, currently, we are seeing BGA problem like solder ball misalign, void, solder short (all under BGA, tested with 5DX), after reflow. We examine the solder ball (raw material of BGA), and see that the ball surface is not smooth, will that affe
Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef
BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr
Electronics Forum | Sat May 26 05:11:43 EDT 2001 | Brian Sloth Bentzen
Dear Philip. BGA�s are very forgiven components when it comes to misplacement. In my experience, 1.27 mm ball pitch BGA�s, can be misplaces by up to 50% of the solder pad. They can easily be placed using only backlighted vision. It will however be a
Electronics Forum | Fri Sep 10 17:18:10 EDT 2010 | spitkis2
They may be misaligned so much so that self centering would not occur. How are you placing the micro BGA's? Depending on how the boards are transported onto the oven's conveyer, by the time they start to go through the oven, there could be additio
