Electronics Forum | Wed Aug 09 09:56:49 EDT 2006 | russ
Can you see the little dots on top of part? there should be three colored dots. If you can see then that tells you the value. Russ
Electronics Forum | Tue Jul 19 08:12:23 EDT 2005 | davef
We agree with Rob. It looks like either kiss is blowing the paste around. It could be: * Nozzle id too large. * Kiss is occuring after the head has moved from the component. 0408%20MS%2001.jpg - Paste is not missing on the bottom-center pads. It is
Electronics Forum | Mon May 19 17:17:41 EDT 2003 | JB
We currently use a Universal GDM for our glue dispensing applications, piston pumps. My question is: Have you had any problems with air getting in the dispense system that will cause missing dots? If so, how have you approached to this problem? Int
Electronics Forum | Mon Apr 02 10:50:39 EDT 2007 | CAN
We have simmilar probelms with a GSM. Lie to it and tell it there are less pins. If there are 6 pins on each side tell it there are 4 and to ingnor the outer 2. then it may miss the dot. Or have it look at just 2 sides like a SOIC.
Electronics Forum | Tue Dec 05 13:34:51 EST 2000 | NickMata
Hello all, at the present I have some product onto which I glue backside components. I dispense a pattern of "witness" to use as a visual cue as to the quality of the dispensed glue dots. A problem which I have encountered is that operators will oft
Electronics Forum | Mon Mar 03 11:06:13 EST 2003 | msivigny
Hi floydl, I completely understand when it comes to data crunching after long hours of performing measurements, it's the last and most important arduous task in obtaining performance data. If a measurement and evaluation process that traditionally to
Electronics Forum | Tue Oct 03 20:35:23 EDT 2000 | Dave F
1. Throughput * Dispenser: Slower, may loose 70% of tact on fast chip shooters * Printer: Can be put in front of and use fast chip shooters effectively 2. Rework Rate ???? Deposition control???? * Dispenser - High control over amount paste - Coplan
Electronics Forum | Mon Oct 21 10:05:53 EDT 2002 | John S
We just started using DEK's pump print process on a high volume SMT line. We are using Hereaus 955. It works well for most components, but we have an issue with missing/partial glue dots on large diameter deposits (0.050"). The stencil will be com
Electronics Forum | Wed Dec 06 13:47:15 EST 2000 | JAX
Nick and Dave, Did I miss the question? What does it matter what pattern the glue dots are in, whatever vision you use will have to read the individual dots anyway. If your glue machine is any good you should be able to get away with simply
Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
