Electronics Forum | Mon Jul 14 12:24:02 EDT 2003 | MA/NY DDave
Hi So Steve, I must have missed something from your last subject topic. "solder fillet peeling" Are you saying you or they, Ultrasonic Clean for 20 to 30 minutes after soldering and that is suspected as causing the cracking at the top of the compo
Electronics Forum | Fri Nov 22 16:59:43 EST 2019 | dwl
I'm worried about the voids that you have on the heel fillet of the leads. Off the top of my head, I don't recall if/what the IPC spec is for voids in gull lead fillets is but my gut instinct is that you're compromising the mechanical strength of the
Electronics Forum | Thu Aug 04 16:34:03 EDT 2005 | bhu
You haven't mentioned whether you are producting only through hole product or if it is mixed technology. What kind of flux (no clean, H2O clean) you are using and whether you performed a first article at part stuffing prior to wave. Generally, you
Electronics Forum | Mon Mar 08 05:03:24 EST 2010 | grahamcooper22
Hi, I fully agree with isd.jww. The difference in the solder joint appearance of the 2 joints highlighted could be down to a few reasons...reflow profile (I know you've checked, but have you stuck a thermocouple on this actual joint ? ), contaminatio
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow
Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill
Electronics Forum | Tue Jun 10 20:31:55 EDT 2003 | iman
In a perfect world, the machines would be maint."guys" for the automation machines. Think "closed loop" system. Anyway, getting back to our reality job, we are still game for automation to improve thru'put, quality, reduce problems. The focus here
Electronics Forum | Fri Oct 13 15:26:20 EDT 2000 | Dave F
We periodically see chip caps with poor solderability. Often terminations are missing plating.
Electronics Forum | Fri Oct 11 03:56:39 EDT 2019 | chrislandafont
Hi Tsvetan, Yes, I've heard it's difficult to program but good once it gets going. At the moment, I'm working through the manuals, but can't find a step by step guide, just lots of reference material on how to do things, but not knowing what orde
Electronics Forum | Mon Jun 27 09:38:30 EDT 2005 | Bob R.
What problems are the quality people seeing? I hope they aren't expecting a toe fillet. QFNs are typically cut from an array after plating. This leaves exposed copper on the sides of the part. We'll often see smearing from the sawing process that
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