Electronics Forum | Tue Jan 23 11:37:13 EST 2007 | electronhose
Here in the Great White North, the best way to check our CM's compliance with the ESD 20.20 is to take a couple months worth of data during heating season and graph it against the outside temp swings. You can easily see how the HVAC system keeps up,
Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef
Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
Electronics Forum | Thu Jun 28 09:11:19 EDT 2012 | davef
I though this was a good article on picking a part numbering scheme and since you weren't getting any takes figured I throw this out there and maybe get a conversation going. Part number system: How to get started Filed under: Item and File Man
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