Electronics Forum | Wed Feb 16 17:28:14 EST 2005 | davef
Greg: As we understand it, in your situation: * One 0805 lead solders to board properly * Another 0805 lead does not solder On the 0805 lead does not solder, there does the solder go? * On the pad * On the component lead A common solderability test
Electronics Forum | Wed Feb 16 14:59:28 EST 2005 | greg
Thank you for respond. Could you describe me how to make solderability tests please? Greg
Electronics Forum | Wed Feb 16 12:34:49 EST 2005 | greg
Hi all We recently have a problem with component in package 0805 (capasitor 100nF). I have noticed that after reflow soldering only one lead of the component is soldered. The second one is just laying on the PCB land. We use screen printing process
Electronics Forum | Thu Feb 17 04:09:19 EST 2005 | greg
The solder adheres to the lands very well so i don't think that problem is with solderability of the PCB. Not wetting to the 0805 terminations. When the problem appeared with the 0805 we chenged the supplier. But there was commnon element Pb-free te
Electronics Forum | Wed Feb 16 14:50:46 EST 2005 | Valerie
You could have a supplier problem. We had a similiar problem with one of our capacitor suppliers. I would suggest doing a solderability test on the component right out of the tape.
Electronics Forum | Wed Feb 16 17:38:17 EST 2005 | russ
have you checked the registration of the component prior to reflow? If this is good, why don't you take another P/N (0805)that is okay and place of few of them in the trouble spots and see what happens.
Electronics Forum | Thu Feb 17 08:14:57 EST 2005 | davef
The issue may not be the solderability protection. It could be that the metalization on the component terminal or the metal of the component terminal was not prepared properly before the solderability protection was added.
Electronics Forum | Thu Feb 17 12:04:52 EST 2005 | Indy
Have you tried doing solder dip test on these components? Or a Leaching Test, to see if the solder catches on the termination ? I suggest you should try these tests.. Cheers Indy
Electronics Forum | Thu Jan 05 17:06:38 EST 2006 | russ
Is it now acceptable to discard the SAC alloy directly into the trash or is it still a requirement to dispose of through hazmat procedures. Seems to me that we can now just chuck the old paste right into the normal trash since it is the replacement
Electronics Forum | Fri Jul 28 09:40:11 EDT 2006 | pavel_murtishev
Good afternoon, 1. Yes, most of all I suspect the components. Could you explain what does mean "reflothermal recipe"? Ramp-to-spike? Ramp-soak-spike? Something special? Thanks. 2. Void is really huge. This voiding differs from "standard" voiding ef
