Electronics Forum | Thu Apr 01 15:31:23 EST 1999 | Brian
B: Edsyn make a nice tool to Solder Dress, check out the TSX-70. It'll blow and suck at the same time! | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardo
Electronics Forum | Sun Jul 18 21:36:42 EDT 2004 | KEN
This is the least desirable method (mirroring). 1. X-ray inspection becomes difficult. I will repeat: x-ray inspection becomes difficult. False fails go up. True fail detection goes down. 2. Remove and replace becomes challenging. You really
Electronics Forum | Mon Sep 19 06:24:59 EDT 2005 | OEM Manufacturer
Does anybody know of any standards that are available that cover how many times a part or complete unit can be reworked before it is considered to be scrapped? I am currently writing a process to review this with a supplier. For example, a bga devi
Electronics Forum | Mon Oct 17 06:29:03 EDT 2005 | bandjwet
Please define the pitch of the devices, package size and area rray package style so we make a recommendation. Also let us know the kind of product you will run in terms of their value (WIP cost @ time of rework), maximum board size and board thicknes
Electronics Forum | Wed Jan 14 22:47:24 EST 1998 | Ron Costa
I've had demo's on two machines recently. HTI Engineering in Medfeild MA. has a very nice machine. Singularity in Portsmouth N.H. has a very basic , simple machine. You should check tooling costs. If you would like to talk more about it give me a c
Electronics Forum | Thu Sep 22 14:25:13 EDT 2011 | hegemon
Dave has stated the caveats well. I too have similar experience in reworking BGAs that mirrors your own. The only situation where I saw this as an issue, was in memory devices where a row of BGAs might share a commonm heatsink. In those cases the
Electronics Forum | Tue Sep 11 12:45:01 EDT 2007 | rgduval
Both questions will depend upon the IC specifications. Check the manufacturers recommendations for temperature specification, as well as reflow profiling. As a general rule, we don't like to rework a component more than 2 times after initial reflow
Electronics Forum | Thu Feb 19 22:11:35 EST 1998 | Brian Morgan
| We are in need of a low cost system for the rework of | various SMT devices. Ideally the machine should support BGA, | SQFP, and large PLCCs. | Is it a dream to ask for SMT tweezers, a regular iron, | and a convection pencil as well? Want a machin
Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis
| | What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | | | Thanks, | | | | Frank | | | Frank, | Refer to the device manufacturers. they are going t
