Electronics Forum | Mon May 21 16:34:23 EDT 2007 | jeremyl
Thanks for the feedback. The Finetech machines look very nice, but are far out of our budget. While we are looking for the most cost effective solution, we are able to spend ~$15K on this machine. We really just need a reliable way to remove and rep
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Fri Aug 01 18:50:02 EDT 2014 | hegemon
There are no BGA rework stations in that price range that I would consider for purchase. (or did you miss a zero in your cost estimate?) In order to have placement, and sufficient heating for proper BGA rework (top and bottomside)you're going to hav
Electronics Forum | Wed Jun 17 17:26:26 EDT 2009 | bandjwet
We are having to put an Intel Core 2 Duo Solo mobile processor in a 478-pin micro FCPGA package into a ZIFF socket. The devices currently only have lands (device rework) and we would like to attach the pins. Does anyone know the material compositio
Electronics Forum | Fri Jan 28 09:30:07 EST 2005 | reash
Well the powers that be actually want to go with a regular rework station, for future growth. I guess they plan on using BGAs sometime in the near future. We're also planning on using a D-Pak device in this first board. So now we're looking at the
Electronics Forum | Thu May 08 15:51:06 EDT 2008 | radab
Hi, I have some BGA devices, a plastic FCBGA memory chip (to be replaced) and an exposed-die FCBGA processor here which need reworking. I picked up an Aoyue hot air rework station (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=383) along with t
Electronics Forum | Mon May 12 09:36:05 EDT 2008 | radab
Hi, I have some BGA devices, a plastic FBGA memory chip (to be replaced) and an exposed-die FBGA processor here which need reworking. I picked up an Aoyue hot air rework station (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=383) along with the
Electronics Forum | Mon Sep 01 02:24:10 EDT 2008 | omid_juve
we use another device with the same package but it doesn`t have any solderability problem . the things that we are hesitate on is the difference between the pin alloy in these two different packages . also i should say that in rework station it will
Electronics Forum | Tue Nov 20 19:56:12 EST 2012 | hegemon
In order to be able to do full prototype assembly, you will need to be able to mount and reflow a large number of different devices of differing technology. One part might be a simple QFP, another might be a .4mm pitch uBGA. If you are prototyping a
Electronics Forum | Fri Jun 28 06:12:27 EDT 2013 | grahamcooper22
If the soldering process isn't heating the whole package up to soldering temp then NO you don't need to keep them DRY (using a soldering iron to fit a QFP for example)....but if the soldering process is done on a rework station or in a manner where t
