Electronics Forum | Thu Mar 26 11:25:21 EST 1998 | Earl Moon
In December and January (1997 & 1998) a number of people requested information regarding component cracking. I overlooked this until recently thinking design and process requirements were violated. After reviewing the last 14 months consulting effort
Electronics Forum | Mon May 27 12:14:35 EDT 2002 | arcandspark
I use the exact same paste flux that we use in our solder paste for SMT manufacturing with great success. I have also had great success using the Air Vac DRS Hot Gas units with the same size BGA's. If to much heat is applied to fast to the BGA be it
Electronics Forum | Mon May 18 10:54:46 EDT 1998 | Jerry
If it's really low volume I would only invest in a stencil printer and convection reflow oven to start with. If you want to go really low budget get a manual unit such at one from Transition Automation. Make up some really good shop aids and have s
Electronics Forum | Wed Jun 17 17:26:26 EDT 2009 | bandjwet
We are having to put an Intel Core 2 Duo Solo mobile processor in a 478-pin micro FCPGA package into a ZIFF socket. The devices currently only have lands (device rework) and we would like to attach the pins. Does anyone know the material compositio
Electronics Forum | Wed Dec 26 16:52:57 EST 2012 | davef
"Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework" Author: Brook Sandy, Edward Briggs and Ronald Lasky, Ph.D. Abstract: The increased function of personal electronic devices, such as mobile phones and personal mus
Electronics Forum | Wed Oct 03 23:59:44 EDT 2018 | gaintstar
Flason SMT problem solving: http://www.flason-smt.com/new/PRINCIPLE-OF-SURFACE-MOUNT-PROCESS-SMT-PROCESS.html http://www.flason-smt.com/new/Printed-Circuit-Board-PCB-Price-Estimator.html http://www.flason-smt.com/new/Printed-Circuit-Board-Solder-res
Electronics Forum | Tue Feb 17 22:23:44 EST 1998 | G Henning
We are in need of a low cost system for the rework of various SMT devices. Ideally the machine should support BGA, SQFP, and large PLCCs. Is it a dream to ask for SMT tweezers, a regular iron, and a convection pencil as well? Want a machine to cover
Electronics Forum | Thu Sep 14 09:20:37 EDT 2006 | CL
Good Morning Everyone, I know there are tools or systems for reforming leads on damaged SMT devices such as QFP's but I am unable to find any specific information on these tools. Can anybody point me in the right direction? Any help would be greatl
Electronics Forum | Tue Aug 22 03:04:07 EDT 2006 | PP
Any help/suggestion is much appreciated I am doing lots of BGA Reworks from a small uBGA with a few balls to a large BGA with over 1500 balls. The reworks have been done on SRT 1100 Series Machine for many years. SRT 1100 Machine is good for the c
Electronics Forum | Mon Jul 08 14:52:40 EDT 2013 | hegemon
The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via. The solder mask may have been damaged or missing prior to mounting the BGA device. The larger balls at the top right are due to uneven heating during
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