Electronics Forum: mobile ics micro jumpers damaged pads (Page 1 of 1)

What is bebind the global chip crisis?

Electronics Forum | Fri Apr 30 13:26:10 EDT 2021 | amaliahx

The pandemic has altered people's habits, causing a surge in demand for home electronic devices. This has swept the global chip supply and disrupted automobile manufacturing. The pandemic has led to the global shortage of semiconductors or chips, and

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

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