Electronics Forum: mobile phone

What methods do you use for final packaging? Bubble Wrap, bags, trays? Anything unique?

Electronics Forum | Wed Dec 10 11:42:49 EST 2014 | arifa_anees

www.apexpackagingcorp.com/manufactures.html www.abcokovex.com/bubble-wrap.html www.murray-packaging.co.uk/mobile/packaging.html‎Cached www.murray-packaging.co.uk/mobile/packaging.html‎Cached please check the above mentioned links for your query. re

BGA function test

Electronics Forum | Wed Dec 22 10:18:52 EST 2004 | tonyfox

Our company laser re-ball's BGA down to 100 microns ball size. One of our OEM customers have asked us to function test there BGA on Mobile phone PCB's. Origionally we thought of a test sockets however the sockets interfere with other devices on the P

Component usage/Reel sizes

Electronics Forum | Thu Feb 18 15:06:18 EST 2021 | robl

0805 has been considered old technology by the component manufacturers for 15+ years. Industrially it's the 0402 100n as the most used part, throw in tablets and mobile phones and it's probably the 0201 100nf or 10nf.

BGA Underfill Rework

Electronics Forum | Thu Jun 01 21:14:21 EDT 2006 | roadhound

Hello, We repair mobile (cellular) phones, and most are now having their u-BGA IC's underfilled. Can anyone suggest methods for removal of the IC's ? The manufacturers are very vague when it comes to this process, but are starting to get tired of u

Reflow Oven Chain Lubrication

Electronics Forum | Wed Oct 23 16:56:03 EDT 2002 | mikestringer

Hi Marc I too have been using a fully synthetic Motor oil on Heller reflow ovens for a number of years. In our case Mobil 1 5W-50. We have a field failure problem with some 1% resistors under conformal coating where sulphates are dissolving the si

Hallo, Hallo!!! Is that my cell or is it yours?

Electronics Forum | Wed Feb 12 23:48:00 EST 2003 | Dreamsniper

Hi DaveF, We do not allow people to have their cell / mobile phones if they are working or entering our Production / Manufacturing Facilities due to the signal interruptions that our test systems are receiving. Notice that when your phone rings your

Lead free Solder Paste troubles !!!!

Electronics Forum | Thu Sep 23 23:42:52 EDT 2004 | KEN

The LF pastes will have virtually NO wetting spread. This is normal. LF mobilities are virtually non-existant with SAC alloys. However, the addition of varrying amounts of silver can (and does) improve mobility but, this comes with a price (paste

Nitrogen in the Reflow Oven

Electronics Forum | Wed Oct 16 09:55:24 EDT 2013 | markhoch

Thanks guys. I can see the benefit as a CM, when you have no control over the Parts/PCBs that come in the back door. In my previous job at a CM I did often have product coming in the back door that did appear to have exceeded its shelf life, and hav

DEK conveyor belt

Electronics Forum | Wed Jul 15 03:17:47 EDT 2020 | wellmanrau

We have been producing the SMT machines and intelligent equipment for many years, integrated Design, R&D, Production, Sales and Technical Service. What products we manufactured are: SMT Printer/Stencil Printer/Solder Paste Printer, Pick and Place Mac

Re: SMT Placment Reliability

Electronics Forum | Fri May 05 20:07:26 EDT 2000 | TNT

Charles, The percentage of misplaced components can increase with the number of components, because as you increase the number of placements the travel of the PCB,for a fixed turret machine, increases in table speed and distance. The slower the trav

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