Electronics Forum | Mon Dec 31 09:00:06 EST 2001 | davef
Baking before assembly does nothing good. It: * Increases costs. * Adds steps to the process and makes scheduling more cumbersome. * Increases the amount corrosion on solderable surfaces. We used to bake to remove the moisture from boards that caus
Electronics Forum | Fri Aug 08 18:06:35 EDT 2003 | davef
Antistat sprays are a waste of time and money. These sprays just soaps disolved in water that absorb moisture from the air. Your minimum requirements: Conductive floor mats and wrist straps that are properly grounded. From there, consider using
Electronics Forum | Mon Jul 26 18:03:45 EDT 1999 | John Thorup
| We only do rework with SMT components or a small amount of SMT work. We are having a hard time keeping the components safe throughout the handling process of removing one or two components, and issuing them to an operator for processing or inspect
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Tue Jul 16 01:12:31 EDT 2002 | ppcbs
We find that baking PCB assemblies at 90 degrees C in a Blue M forced air oven is safe for most all PCB's that we have encountered over the past 12 years. We remove any external plactic hardware that may be attached to the assembly and also like to
Electronics Forum | Thu Feb 07 09:07:10 EST 2002 | fmonette
Dason, Please be aware that weight gain is only a very crude estimate of the component moisture content. This is only accurate when the moisture is uniformly distributed inside the component (which is actually never). This measurement is usually no
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Wed Feb 06 19:28:43 EST 2002 | sleech
I agree with Francois. We have just announced a 55 deg. C LTVP drying process that can greatly speed moisture removal. It is also effective for drying components that remain in tape and reel, conductive plastic shipping tubes or trays. Process time
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette
Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w
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