Electronics Forum | Wed May 12 10:29:25 EDT 1999 | Timothy O'Neill
| | | Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | | | I do not think there is a "typical" post reflow cooling rate
Electronics Forum | Mon May 10 15:49:52 EDT 1999 | Steve Gregory
| | Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | | I do not think there is a "typical" post reflow cooling rate out
Electronics Forum | Tue Jan 16 13:47:24 EST 2001 | cebukid
10% on various BGA packages. I checked the profile and we are getting "ideal" reflow conditions (~ 60 sec. T.A.L.). Ramp rates, temperature deltas before spike zone, and cooling rates are ideal too. I don't believe it's a profile, print, or paste
Electronics Forum | Fri Jun 01 11:06:17 EDT 2012 | davef
Post-reflow delamination is almost always caused by entrapped moisture. Here's more from the fine SMTnet Archives ... http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=64774 As Graham Cooper suggests in an earlier posting on this thread, ba
Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F
Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm
Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef
No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste
Electronics Forum | Thu Dec 24 08:44:25 EST 1998 | Earl Moon
| | | | Folk's, | | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colou
Electronics Forum | Mon May 31 15:09:56 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Mon May 31 15:10:14 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach
| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H
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