Electronics Forum: moisture ingress (Page 1 of 3)

Re: Moisture ingression on components

Electronics Forum | Mon Apr 17 06:02:24 EDT 2000 | clong

Where would i get more info on various barcode reader systems and are there cheaper alternatives to this

Re: Moisture ingression on components

Electronics Forum | Thu Apr 13 20:34:58 EDT 2000 | Dave F

I agree with Wolfgang. If you don't control your processes, they will control you ... and they will put you out-of-business, if you let them. Ta. Dave F

broken components

Electronics Forum | Fri May 29 02:02:07 EDT 2009 | cobar

The problem could be that the preheat temp of the PCB is too low on entering the bath.Also look at moisture ingression of components.Have a look at solder Assit at http://www.shanelo.co.za

Moisture sensitive device re-packaging

Electronics Forum | Wed Aug 11 10:28:20 EDT 2004 | Richard Evans

We currently are supplied parts that are moisture sensitive that have high MOQ's even though product volumes are low. These devices are heat sealed by the manufacturer but we have no method to re-seal the packaging to protect the remaning items from

Re: Moisture ingression on components

Electronics Forum | Fri Apr 14 09:14:29 EDT 2000 | Rich Ziebell

C.Long, Have you thought of using a barcode reader system? Though costly, such a sytem would minimize the room for error and neglect by your operators. Yes, physical tickets would still need to be applied (barcodes labels) but there would be less ef

Moisture ingression on components

Electronics Forum | Thu Apr 13 05:13:22 EDT 2000 | C.Long

Anyone have any ideas as how to track the amount of air exposure to SRAMS etc as thay move from stores onto the production floor. i am looking for ideas as how to track the exposure time from the time they are taken out of ther packaging to the time

Re: Moisture ingression on components

Electronics Forum | Thu Apr 13 10:01:54 EDT 2000 | Wolfgang Busko

Hi: Use the whip on your operators.!!! Serious: The assembly should know how much time they have left to process those parts safely. Keep them as long as possible in the drybags, reclose the bags immediately after getting the needed parts out. In t

MLCC crack detection

Electronics Forum | Fri Sep 03 11:45:15 EDT 2004 | rlackey

Hi Ken, I know this doesn't help in the immediate timescale, but isn't avoidance the best form? can you trace the cracking to a process issue (Solder profile, shock damage, handling damage, probe/ATE damage)or a chip cap manufacturing fault? I can'

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont

We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte

Moisture sensitive ICs in repairs/refurb

Electronics Forum | Fri Jun 07 10:02:01 EDT 2013 | sarason

In thirty years of Electronic service I have never had problems with moisture in boards when hand soldered. I have worked on boards in boxes for defense through industrial control, joy rides etc. Sometimes they some back buried in half an inch of dus

  1 2 3 Next

moisture ingress searches for Companies, Equipment, Machines, Suppliers & Information

Global manufacturing solutions provider

High Precision Fluid Dispensers
Blackfox IPC Training & Certification

Wave Soldering 101 Training Course
SMT feeders

Best Reflow Oven
High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
PCB Depanelizers

Low-cost, self-paced, online training on electronics manufacturing fundamentals