Electronics Forum | Tue Feb 19 08:46:06 EST 2008 | rgduval
The last time I encountered dendrite growth, it was within a component package. I believe we were experiencing it within a crystal. The root cause was water intrusion during in line wash. The component was supposed to have been sealed and safe for
Electronics Forum | Tue Apr 02 11:21:46 EST 2002 | BTaylor
davef I assume this question is for my reply and me. We used a dexter\hysol underfill and a Camalot 5700 to dispense.Single line technique next to a small IC with 14 bumps around the perimeter.The conformal coating was applied with a small brush aro
Electronics Forum | Wed Apr 27 23:23:18 EDT 2005 | pdeuel
It was a resonant frequency that brought down the Narrows bridge. Memorex can shatter a wine glass with resonance. Ultrasonic washers use frequency to do what they do. If anything on the pcb has a length width or mass that resonates at the washers fr
Electronics Forum | Fri Sep 05 13:33:28 EDT 2008 | jmiller
We are having problems with relay package seals cracking and moisture intrusion in power relays on thru-hole assemblies. we use a few different brands of thru-hole relays, we are using a sn-pb process right now and just going to lead-free. the contra
Electronics Forum | Mon Sep 08 08:59:45 EDT 2008 | davef
You're correct: * Sealed relays should not be cracked or have moisture intrusion. * Hand soldering relays is going to be expensive. [Using a mini-solder pot for this might reduce some of the burden.] The good part is that the problem is gross enough
Electronics Forum | Mon Apr 29 22:41:36 EDT 2002 | davef
Refer to J-STD-33 - Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface-Mount Devices. You can be downloaded it free from http://www.jedec.org Assuming you want to meet expectations when selling your components to
Electronics Forum | Fri May 15 10:27:16 EDT 1998 | Justin Medernach
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Fri May 15 10:06:28 EDT 1998 | Mike
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Mon Aug 18 15:04:25 EDT 2014 | rgduval
Off hand, I can't recall a "formula" for how long boards could sit in a specific RH environment. I've done a couple of quick Google searches, and can find a bunch of information on the dispersion rate of moisture in various PCB materials, but, nothi
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
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