Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette
I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho
Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Tue Dec 14 02:19:03 EST 2010 | sachu_70
With lower Humidity levels, we expose to greater risk towards ESD related failures seen on components. Pl. ensure to have your entire work area fully guarded against ESD and maintain proper material handling instructions across the entire flowline un
Electronics Forum | Thu Apr 01 14:00:17 EST 1999 | Ron Beasley
| | Has anyone heard of a problem with catastrophic failure of | | large value (200uF) solid tantulum capacitors that have been | | exsposed to high humdity. | | | I suppose that with water moisture seep in the capacitor, the risk is very high tha
Electronics Forum | Fri Sep 02 08:52:36 EDT 2005 | davef
Dougs: What is the purpose of this test? Lately, we have had a lot of boards that do not withstand the Drive-Over The Board With A UPS Truck Test. We wonder is the is some relation between our test failures and your customer's.
Electronics Forum | Mon Jan 06 17:37:54 EST 2014 | hegemon
Make sure you are providing an adequate moisture bake out prior to wave soldering. It sounds moisture related since is so random. I would suggest perhaps 120C for a minimum of 8 hours to drive the moisture out, and then complete your wave soldering
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Tue Feb 19 08:46:06 EST 2008 | rgduval
The last time I encountered dendrite growth, it was within a component package. I believe we were experiencing it within a crystal. The root cause was water intrusion during in line wash. The component was supposed to have been sealed and safe for
Electronics Forum | Fri Nov 16 08:47:04 EST 2007 | rgduval
Fractured parts that we've seen at reflow in the past are related to trapped moisture in the part, out-gassing at temp, and fracturing the part. I have seen this on ceramic resonators in the past; don't know why this type of part seems prone to this
