Electronics Forum | Mon Jul 23 08:35:33 EDT 2012 | grahamcooper22
The lower the RH in the MBB the better for all moisture sensitive devices. Maintaining less then 5% will mean no parts of between 2a-5a MSL will need drying before use. The calculation uses 10% because it is a sensible amount of desiccant to use base
Electronics Forum | Wed Oct 01 14:56:56 EDT 2014 | tim_wilkinson
Fuji_user_2014, I work in sales at Manncorp and we have a two styles of dry boxes you may want to consider. We have dry desiccant boxes that will store your components at less than 5% RH. We also have dry baking boxes that will store your componen
Electronics Forum | Thu Oct 31 17:24:53 EDT 2019 | slthomas
Sorry I can't really answer any of your questions, but I'm curious about your idea. I've done vacuum drying of implantable medical components (made mostly of a proprietary bio-absorbable composition) but never electronic components. You're right to
Electronics Forum | Thu Sep 16 21:11:10 EDT 2004 | davef
Left to its own devices the plastic used to seal your parts will take-on moisture in the air. When you heat there parts the water in the part expands and can damage the part, if not properly demoisturized. The instustry standards for controlling su
Electronics Forum | Fri Aug 12 22:10:24 EDT 2005 | Mika
I agree with all the prior postings! But I have some additional thoughts about this. If there is a build up of moistures (% humidity) inside the pcb; before you reflow the pcba; then you will have the result out of the oven, just as you described. My
Electronics Forum | Mon Jan 15 15:33:41 EST 2001 | davef
First, we have never repackage devices, as you propose. Our schedule has us standing at Receiving like panting dogs waiting for the material required to jump the job, much less giving up the time and money to have parts repackaged. Second, fabricat
Electronics Forum | Wed Apr 19 22:45:31 EDT 2000 | Dave F
Rich: You should raise the issue until someone BIG smacks you!!! We were getting deliveries from our distributors and virtually every part number had an opened dry pack. We kept SCAR'n the dudes until they came in and sat down. It took a while ..
Electronics Forum | Wed Sep 29 07:28:04 EDT 1999 | Wolfgang Busko
3�C/min) or maximum temperature (~240-250�C)." For the correct handling of moisture sensitive devices and prebaking advices see IPC-SM-786A or newer publikations. I encountered the following: A tray of sample BGAs was send to me proper packed and se
Electronics Forum | Thu Sep 16 05:37:18 EDT 1999 | Earl Moon
| Can you imagine that there is a smt process using the a few chip and ic are nearly about 4,5,6,8 years old. | Antigues?? | what should you do If you are an engineer of smt process in that company. | | | | thank in advance. | | I'm s
Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
