Electronics Forum | Wed Sep 23 10:42:13 EDT 2015 | ehess
is it necessary to vacuum seal moisture sensitive components? Or can we just seal with desiccant in proper bags?
Electronics Forum | Wed Nov 11 22:13:45 EST 2015 | jackzhong
Hi, if you seal in proper way, it is not necessarily to vacuum. we are specialized in moisture solution for electronics and components. Maybe we could give you some workable advice or solutions. If you are interested, contact me by Skype:dryplus1 o
Electronics Forum | Wed Sep 23 13:20:02 EDT 2015 | emeto
Depends on the MSL(Moisture sensitivity level) and how far you will use them in production. Here you should be able to get all the answers: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm
"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea
Electronics Forum | Tue Jun 27 08:08:23 EDT 2000 | Christopher Lampron
Hello All, My question is in regards to repackaging moisture sensitive components. I have researched the archives and found alot of valuable information. We currently have a heat sealing machine but do not have the capability of evacuating the bag pr
Electronics Forum | Mon Dec 28 14:57:07 EST 1998 | Earl Moon
| Looking for additional handling and baking information of moisture sensitive IC'c beyond/or inadditotn to IPC - SM - 786 A. Publications, guidelines, baking experience. | Much depends on your environmental controls and those of your suppliers. PB
Electronics Forum | Fri Sep 24 04:57:22 EDT 2004 | FengAng
So many people have concerns on the MSD(moisture sensitive device), but I want to know if anybody can SHARE me some information about the TSD(temperature sensitive device). And I think there are also a lot of knowledges need us to learn. In my opini
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
Electronics Forum | Tue Aug 19 13:47:46 EDT 2003 | slthomas
What are you going to fill the chamber with when it needs to be opened? If you use air, will the evacuated components suck up any available moisture? I've never done anything like this with electronic components, but some of the more porous materi
Electronics Forum | Mon Dec 28 12:33:58 EST 1998 | Brian Gurney
Looking for additional handling and baking information of moisture sensitive IC'c beyond/or inadditotn to IPC - SM - 786 A. Publications, guidelines, baking experience.
