Electronics Forum | Fri Sep 24 19:17:36 EDT 1999 | Tom Tellinghuisen
Al, There are no 'rules of thumb' that you can utilize for plastic devices. I have seen various Moisture Sensitivity Levels, (MSLs), for the same package type, i.e. PLCC28s as levels 1, 2,3,4,5, even 6 in some cases. Your best bet is to call
Electronics Forum | Thu Sep 23 10:28:48 EDT 1999 | Wolfgang Busko
| Hi All, | | I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. | | | thanks | | I appreci
Electronics Forum | Thu Aug 26 10:49:36 EDT 1999 | Wolfgang Busko
| | | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | | Going through datasheets wasn�t that helpfull, so does anyone know of a source
Electronics Forum | Sat Aug 28 08:41:12 EDT 1999 | Tom Tellinghuisen
Wolfgang, We also tried to find generic 'guidelines' for Moisture Sensitivity levels. It would be a perfect world, if you could say that all PLCC84's were level 4 devices. Unfortunately it is not that easy. Moisture sensitivity levels are
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Tue Mar 18 17:13:47 EST 2003 | Carol Stirling
Hi -to all those familiar with MSL, I have a few questions on Moisture Sensitivity Levels (MSL) with ICs. We have been assured by our distributers they mark any package of ICs shipped according to J-STD-033. We receive ICs marked as Class 3 and up,
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette
One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
