Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette
The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac
Electronics Forum | Thu Oct 02 16:22:46 EDT 2008 | davef
Not all paste formulators offer suggestions on handling the storage of opened paste jars, but some do. Here's a couple. Storing Opened Solder Paste Containers * Once a jar or cartridge has been opened it should not be re-refrigerated. If solder past
Electronics Forum | Sat Jan 13 03:43:38 EST 2007 | Stephen- SMT engineer trainee
We are now using solder paste(OM325) and I have some problems on the folowing process: 1. We use the solder paste softer(Malcom SP-1) to warm-up for 20 mins, when it just take from refrigerator. Is there any problems for solderpaste performance? 2.
Electronics Forum | Thu Apr 26 16:52:53 EDT 2001 | fmonette
Robert, Someone already mentioned the popcorning phenomena. This would show up as a dome-shaped deformation underneath the component, due to internal delamination around the die area. However what you describe sounds like another moisture-related
| 1 |
winsouce.jpg)
