Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Mon Jul 07 23:27:41 EDT 2003 | MA/NY DDave
Hi Sam, I am going to guess that a problem is being caused by processing to effect the inside of the LED package. Send some failed LEDs back to the manufacturer to do a failure analysis. Also ask the manufacturer for info on their SMT processing q
Electronics Forum | Thu Jan 07 15:28:52 EST 2010 | cbart
did the boards get built by hand or via smt process (through reflow oven)? Someone asked earlier if some one touched up the adjacent joint. The answer to that question is yes. Look at how the solder tails off the smt pad away from that joint! I suspe
Electronics Forum | Mon Jul 07 00:22:38 EDT 2003 | sam
Thanks for all the answers. I should clarify that the problem was found to be on the SMT LED gold plating, instead of PCB gold plating. We had confirmed this problem by running some DOE experiments and some reliability testings. We had decided to d
Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Fri Jul 04 12:32:33 EDT 2003 | sam
I need some advice about a problem that happened in a SMT LED: The failure symphoms of this SMT LEDs is that the LED body itself seemed to be functional, but when soldering on the products, it showed good wetting and soldering, LEDs are bright and l
Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt
Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r
Electronics Forum | Fri Jan 15 13:35:03 EST 1999 | Terry Burnette
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
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