Electronics Forum | Fri May 18 13:41:34 EDT 2001 | mparker
Good ol' Yankee engineering always says "More is better" You have got to be careful that with more epoxy volume you run the risk of the epoxy merging with solder paste if you are using a glue and paste process. In addition, if the epoxy can spread o
Electronics Forum | Wed Jan 19 01:01:51 EST 2000 | park kyung sam
Would you give me more detail please? i don't understand. is it general in smt process out there or your opinion. thanks in advance.
Electronics Forum | Fri May 18 12:21:28 EDT 2001 | camohn
When it comes to how much epoxy [aka. "glue"] to dispense to hold a IC or any part with significant mass, on the bottom of a board for wave soldering, is more better? The way I see it, one good dot should be holding such a part on the PCB. If not, th
Electronics Forum | Mon May 21 17:34:22 EDT 2001 | davef
Continuing the line of Michael's, the previous poster, comments ... The more Krispy Kremes, the better. Yeth!!! The more beer, the better. Yeth!!! The more epoxy, the better. Uh, I don think so!!! We look at this from a papa bear, mama bear, bab
Electronics Forum | Wed May 30 17:59:16 EDT 2001 | jollyrodger
It may be the case (if you are using stencils to apply the epoxy) that you will have to indeed use a stepped stencil to appply the epoxy at a greater height. Not being an engineer i am not completely clear with the involvements of stencil design -
Electronics Forum | Wed May 30 17:59:24 EDT 2001 | jollyrodger
It may be the case (if you are using stencils to apply the epoxy) that you will have to indeed use a stepped stencil to appply the epoxy at a greater height. Not being an engineer i am not completely clear with the involvements of stencil design -
Electronics Forum | Wed Jan 19 11:31:58 EST 2000 | Dave F
You said: "how come do i calculate the money for one chip mounting. I really want to know that. Maybe someone already has it. Shortly speaking , CALCULATION EQUATION FOR 1 CHIP MOUNTING COST IN SMT PROCESS." So, I gave you equations for calculating
Electronics Forum | Thu Apr 13 11:38:53 EDT 2000 | Kevin Facinelli
Couple more questions: The problem we have is that on the bottom side we are using a bunch of resistor networks. These have been very difficult to solder through the wave. The products: Top Side: 4-6 BGA 2/3 QFP 500 component
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
Electronics Forum | Sun Apr 25 04:34:09 EDT 1999 | Earl Moon
No this message isn't about my triumphant return. It's not even about that lady I wanted to run away with to Mehico (who were you again). It's about progress and some of you might be interested, or not. 1) For DEKheads, I submit we had two of Britai
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