Electronics Forum | Thu Jan 25 09:52:51 EST 2007 | chrisgriffin
Force is definetely necessary. It really doesn't have much to do with board thinckness, if everything is programmed correctly. It is just the downward pressure applied to the stencil during printing. You are supposed to adjust this depending on yo
Electronics Forum | Mon Apr 01 20:40:49 EDT 2013 | aemery
Quite sure it is one of the follow things. Squeegees are not tall enough (using after market blades); Are you using a stencil adapter? bottom surface of the stencil must be even with the top of the stencil shelves; printhead assy. is modified, faile
Electronics Forum | Thu Feb 21 21:50:38 EST 2002 | dougk
Silly question, but, are TR blades 'exactly' the same size as MPM's and seat themselves in the holders just like MPM's? Also, different types of steel are harder (less flexable) than others. Are TR's the same? If harder (due to steel strength or coat
Electronics Forum | Thu Dec 18 21:36:03 EST 2003 | pdeuel
Blade angle, print speed, squeegee pressure, should be used in conjenction with one another. The more parellel the blade is to the stencel the more it will tend to float over the solder and the more paste is forced thru the appature. Contrary the gre
Electronics Forum | Mon Apr 01 09:30:41 EDT 2013 | dontfeedphils
Thanks for the reply, this is something that I am actually still fighting. I've been working with MPM directly since we ended up getting a service agreement, but I'm honestly not much closer to figuring it out today then I was when I first posted th
Electronics Forum | Wed Dec 17 09:55:10 EST 2008 | jorge_quijano
Hi to everyone, I will be runnig product with adhesive with a MPM UP2K, I'll use a 0.020" stepped stencil & metal blades. Is it better to use high speed for print head travel? more/less squeegee force than with solder? slow snap off? what could you r
Electronics Forum | Thu Aug 12 22:38:44 EDT 1999 | Dave F
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Wed May 21 09:03:52 EDT 2008 | bing007
I have been confronted with a MPM with a rheometric pump head on and have not had much to do with these. It is giving varying results on the down line paste AOI and is not responding very much to changes in pressure, speed etc. It is a 16inch pump, w
Electronics Forum | Fri Aug 13 12:52:17 EDT 1999 | Steve Schrader
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
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