Electronics Forum | Tue Jun 17 09:00:58 EDT 2003 | fmonette
Good question, here is the short answer : The problem is that dry storage is not the same as a bake process. If you want to bake saturated components, this should be done at higher temperatures. The IPC/JEDEC standard provides a table with bake temp
Electronics Forum | Thu Aug 03 06:26:21 EDT 2000 | JohnW
Folk's, dos anyone have any idea's here I'd gat my hands on some storage cainets for MSD components to allow me to store them on line? cheers JohnW
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Tue Feb 20 16:33:08 EST 2001 | davef
Time, time, time. There just never seems to be enough!!! Eh? You�re correct. Depending on the material, some trays can take a high temperature bake, while other trays, in addition to tubes, and reels, require a low temperature bake. With this la
Electronics Forum | Wed Jul 17 06:54:17 EDT 2013 | deanm
We manufacture according to military Class 3 standards and we do not vacuum seal any MSD devices. Your current method of dry packing is sufficient as well as dry cabinet or nitrogen storage. A light evacuation of air during the dry packing process
Electronics Forum | Thu Sep 15 17:44:15 EDT 2022 | decaire
I agree with Evtimov that sticking with the J-Std-033 is preferable to creating your own procedure at a different temp, especially if you need to pass an audit since the auditors will compare your process to the J-Std. My understanding is that oxida
Electronics Forum | Wed Sep 03 12:44:34 EDT 2008 | Bob Douglas
When considering MSD issues two factors really need to be focused on; first, environmental control of the individual subject component/s during storage and second, monitoring of the packages out of the controlled environment. It's important that eac
Electronics Forum | Thu Nov 08 04:33:39 EST 2012 | grahamcooper22
Make sure that the 40 degree C oven is getting to less then 5% RH inside especially for any applications where you need to dry components....it may surprise you that many ovens set at 40 C will have an internal RH of @ 20~30%....and that is not dry e
Electronics Forum | Fri Nov 17 08:04:24 EST 2006 | jdumont
Morning all. I was wondering if there is a packaging standard (other than 033B) that we can put on our POs to vendors. We are seeing a lot of MSD components come in packaged incorrectly and do not have the man power to bake everything before it goes
Electronics Forum | Mon Jun 25 20:32:44 EDT 2001 | davef
You�re correct. This is a messy situation. Do not store components at the bake temperature longer than the time required to dry out the units for use in the reflow. Long storage times at elevated temperatures can cause soldering problems and the
