Electronics Forum: msd storage cabinet (Page 13 of 15)

MS Level 6

Electronics Forum | Mon Jun 25 20:32:44 EDT 2001 | davef

You�re correct. This is a messy situation. Do not store components at the bake temperature longer than the time required to dry out the units for use in the reflow. Long storage times at elevated temperatures can cause soldering problems and the

BGA Contact

Electronics Forum | Thu Jul 25 03:01:25 EDT 2002 | martz

We experience e-test failure due to BGA problem. The product was subjected to 40 deg.C hot air blowing on the BGA area and it works pretty well. The product then failed when the temperature became 36 deg. C as the hot air blower is withdrawn. If it

MS Level 6

Electronics Forum | Fri Jun 22 12:25:42 EDT 2001 | dason_c

DaveP, once you shut down the oven, the moisture will start and move into the oven unless you can completely seal the oven after you turn it off. Therefore, keep the components into the oven, don't work. However, if the oven is continously on until

Moisture absorbtion in circuit boards

Electronics Forum | Mon May 27 12:24:21 EDT 2002 | arcandspark

Carol, I beleive there is an IPC spec for Moisture control. We see all kinds of problems with boards coming from the vendors. We use to bake all bare fabs upon recieving them. This helped alot but waste time. We now rely on the board vendors to bake

Reel Tracking System

Electronics Forum | Fri Oct 04 16:07:59 EDT 2002 | ksfacinelli

I was interested in hearing about the different techniques companies are using for keeping track of reels. I will start by saying if you have a small number of feeders and part numbers this may not seem to be a big deal but in many larger OEM's the

New to SMT Equipment

Electronics Forum | Wed Sep 17 12:06:58 EDT 2008 | wrongway

Don't forget repairing the boards all the special tips for the small parts sounds like you might be placing BGA may need a special machine just for reparing that. some places think they need x-ray for inspecting BGA. type of paste that you going to

J-STD-033B.1

Electronics Forum | Thu Apr 01 03:44:31 EDT 2010 | nico67640

Good Morning Nicolas, > > Per J-STD-033B, 5.3.3.2 > states that a Dry cabintet maintained at not > greater than 5% RH may be considered MBB > storage. > > Hope this helps > > Chris Thanks Chris for your answer. I'm ok with you about the per

Re: Humidity bake bends leads

Electronics Forum | Mon Apr 19 17:44:43 EDT 1999 | Chrys Shea

| | While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | | I thought I'd ask some experts. Any help guys? | | | Gerry: I imagine there co

Micro BGA baking

Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette

Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes

Re: Handling of Moisture sensitive devices

Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F

Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow


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