Electronics Forum | Tue Nov 10 12:43:13 EST 1998 | Dave f
| What are you people using to store component reels and tubes in? I am looking for a cabinet with slots or something to store reels and tubes. We keep our components on the production floor near the machines. The cabinets we are using now are ver
Electronics Forum | Sun Sep 11 01:25:34 EDT 2005 | Mika
I agree with prior postings, but there is no perfect yes/no answers, right (left)...? Only good questions to be answered. I think it is overkill to have an extra stencil, why do you need it? (That is if you have a proper stencil cleaning equipment).
Electronics Forum | Tue Dec 28 20:34:24 EST 1999 | Dave F
Hey Justin good to see you. You've been using your Terra box for a while now. Cabinet suppliers are: 1 Nitrogen boxes STANLEY STORAGE SYSTEMS P.O. Box 1151/11 Grammes Rd, Allentown, PA 18105-1151 800-523-9462 fax 610.776.3895 storagesystems@mail.
Electronics Forum | Mon Feb 22 12:20:51 EST 1999 | Dave F
| Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. | I have come accross dry nitrogen storage cham
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Fri May 15 10:11:19 EDT 1998 | Justin Medernach
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Thu May 30 10:59:41 EDT 2002 | Hussman69
Diamond/sqaure shapes are good for when you X-Ray the BGA as stated above. The only problem is if you you over print too much, you can get solder beading. I recommend round pads to avoid the beading and use X-Ray to make sure you reflow correctly.
Electronics Forum | Fri Feb 01 16:11:08 EST 2008 | operator
They have been having a lot of fallout and they believe it is one of the BGAs that is causing it. I tell all my customers that it is better to stay away from baking if possible and to practice proper storage techniques. But the thing is they insist o
Electronics Forum | Fri Oct 03 07:49:19 EDT 2008 | grantp
Hi, I just saw the new NXT machines at globaltronics in Singapore, and mostly they are faster. However what was interesting is Fuji shows a prototype of the new XPF machine, but it was called XPF-W which handles really large PCB's and uses the sam
Electronics Forum | Fri Mar 26 03:25:02 EDT 2010 | grahamcooper22
HI, regarding the baking....why are you doing it every 72 hours ? How many times has each device been baked ? If you are worried about moisture in the devices the best policy is to store them correctly in dry packs or dry cabinets or bake them once j
