Electronics Forum | Tue Feb 08 14:14:23 EST 2005 | Jim V.
Looking for suggetions on improving the bottom side connection on MSOP package. What is the common paste / pad / stencil aperture practice?
Electronics Forum | Tue Feb 08 19:45:14 EST 2005 | davef
Use multiple small stencil openings [15 thou square], where total area approximately 50% of total PCB ground pad. What's the problem?
Electronics Forum | Fri Feb 22 18:36:36 EST 2013 | austinpeterman
Has anyone experienced bridging on topside (solder destination side) surface mount devices after wave soldering? We x-rayed 100% of the placements after smt re-flow with no issues. When the same placements were x-rayed after the tht wave solder pro
Electronics Forum | Wed Jul 09 14:47:39 EDT 2014 | deanm
I'm looking for a typical SMT placement defect rate from others in the field so I can judge whether or not we are in an acceptable range. If I give you a board with 200 components (0603, 0805, SOICs, 20mil MSOPs, tantalums, DPAKs and a few 20mil fin
Electronics Forum | Thu Jun 18 23:24:12 EDT 2020 | jmelson
About 12 years ago, this forum was hugely helpful in guiding me to get a Philips CSM84, with no vision. (That might have been a mistake.) Now, I'm moving to smaller parts, especially TSSOP and QFP with 0.5 mm pitch, and the CSM just isn't accurate
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