Electronics Forum | Mon Nov 30 21:28:54 EST 2009 | davef
"Environment Friendly Electronics: Lead-free Technology", J Hwang, Electrochemical Publications, 2001 [0901150401], Chapter 6.2, contains a significant amount of data on 58Bi/42Sn that may help you better understand the 58Bi/42Sn solder alloy. We'r
Electronics Forum | Tue Dec 08 08:52:42 EST 2009 | cunningham
How do people prepare there solder paste for screen print? We currently remove them from the fridge and mix them in a 500g solder paste tub mixer to mix the flux and paste together we waste to much paste at the moment as we only use the tub for 1
Electronics Forum | Mon Dec 14 13:55:24 EST 2009 | dyoungquist
Yes, there will be a difference. When the board is on the rail conveyors it is closer to the top heaters and farther away from the bottom heaters than when on the mesh conveyor. That difference will create different temperatures on both sides of yo
Electronics Forum | Thu Feb 04 04:28:52 EST 2010 | mika
You don't by any chance have a s/w called Motion Control s/w? it's on 1-2 floppy diskettes and it will boot from it also. Normally only the UIC field engineers have/has? this. With this we can actually run each axis & valve or whatever independentl
Electronics Forum | Wed Jan 27 13:55:47 EST 2010 | patrickbruneel
Randy, Thank you for the acknowledgment. The IF2005Mz is a solvent based flux (not water soluble). I agree with you that the original IF2005M had a very narrow process window. In 2000 we modified the blending procedures and blending equipment which
Electronics Forum | Fri Feb 05 20:39:41 EST 2010 | localperm79
I've recently been placed in control of operations of our SCS conformal coat sprayer and I must eliminate problems with wicking of humiseal 1b73 into surface mount connectors while also trying to minimize masking as much as possible. We use a 55:45
Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit
Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower
Electronics Forum | Wed Mar 03 06:13:23 EST 2010 | grahamcooper22
The picture shows that the heel of the device lead is not on the pad. Either bad placement or wrong pad dimensions. I imagine most customers would reject this joint as only a small part of the lead is actually in the solder. With no heel fillet the j
Electronics Forum | Thu Mar 11 03:03:26 EST 2010 | grahamcooper22
Hi , Looking at your photo....can I also see a hole in the middle of the joint on the chip component ? Maybe its not just a problem with th ejoint son diodes ? Did you also get mid chip solder balls on chips? If so, I'd almost guarantee the pcb has t
Electronics Forum | Thu Apr 08 13:28:24 EDT 2010 | mabdalla
Thanks DucHoang, One more favor. Will really appreciate if you can point us on how to figure out the number of patterns (number of offsets) from the VIOS file. Also we would like to know the feeder types represented by the numbers in the &F sectio
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