Electronics Forum: multilayer pcb requirements (Page 1 of 103)

multilayer and difficult and high quality pcb supplier

Electronics Forum | Fri Sep 06 03:06:18 EDT 2013 | 5pcb

We are a complex pcb supplier in China. We are good at making prototypes and multilayer (8-20)layers PCB. If you think your boards are difficult enough, you can contact me. Let's talk details. sales2@dmele.com Name:Lily Tel:0086-0755-23006293.

multilayer and difficult and high quality pcb supplier

Electronics Forum | Fri Sep 06 03:11:31 EDT 2013 | 5pcb

Welcome phone call from all over the world.

Depanel requirements

Electronics Forum | Mon Jan 17 17:20:40 EST 2011 | dyoungquist

The cut can be as close to the component as you want as long as you do not damage the component or any surface mount pads/traces/through holes/internal pcb planes etc.

Depanel requirements

Electronics Forum | Tue Jan 25 21:35:26 EST 2011 | rway

It seems 1/16" has been speced (component to pcb edge). This is our spec and we conform to IPC, but I am not completely sure if this is what IPC std states. Does anyone else know if this is in deed the true spec?

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef

There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si

BGA process requirements

Electronics Forum | Wed Apr 17 22:43:54 EDT 2002 | ianchan

what process is that? can kindly describe? is it that technology where bricks of solder are "ready made" deposit onto PCB pads thus eliminating the need to solder paste print/dispense by machine?

compactflash memory process requirements

Electronics Forum | Fri Apr 19 07:50:24 EDT 2002 | pjc

I used to build flash memory products for M-Systems. Up to 30,000 per week. Nothing special in the process for these boards. 1mm and 0.4mm thick std. FR4 PCBs are used. Double-Sided reflow. The 0.4mm thin boards require process carriers. Panelized 24

compactflash memory process requirements

Electronics Forum | Sun Apr 21 19:56:57 EDT 2002 | francis khoo

Hello Pete, Very true about the heel fillet. Looks like the pad at pcb has to be designed such that the pad should extend at heel but short at toe. About the encapsulation. I can understand the requirements. Can you provide me with a more detail proc

Hi anyone have recommended pcb manufacturer?

Electronics Forum | Wed Aug 02 23:28:44 EDT 2017 | dawson

there are many ideal pcb manufacturers can reach your requirements. multi-layer and hdi boards, you can try and test http://www.madpcb.com

alignment requirements for 0.5mm pitch

Electronics Forum | Tue May 07 08:18:12 EDT 2002 | Sir Alexandr

Almst quality of PCB with this pitch defined on used boards. Good board produses Fullmarks , look up to it , stencil parametrs isnt so critical but board material and layouts.

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