Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Electronics Forum | Tue Aug 18 17:49:16 EDT 2009 | dyoungquist
Is there a limit to how many times a pcb with components can be run through a reflow oven before the components start to degrade? Example: We load the SMT components on the bottom side of the pcb and run it through the reflow oven. Next we load the
Electronics Forum | Wed May 17 03:56:20 EDT 2000 | Wolfgang Busko
Avichai: What kind of PCB are you using, when do you detect that shift (right after placement, before reflow, after reflow), does the shift always appear to be the same or do you see a variation, are you able to identify the process-step where it hap
Electronics Forum | Mon Aug 06 14:08:56 EDT 2012 | dyoungquist
We run a MY12 and our largest layout has 9700 components of which about 8500 (88%) are placed by the Hydra head. Average run time for our layout is 75 minutes. Based on that and depending on what percentage of your components are Hydra mountable, y
Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro
Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al
Electronics Forum | Thu Mar 13 19:11:03 EST 2003 | Wes
Does a third solder reflow compromise component and solder reliability? We find that the only way to rework a particular BGA without warpage is to reflow the entire board.
Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob
I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.
Electronics Forum | Wed Mar 19 16:12:51 EST 2003 | Sudhir
I would suggest to have a rework station to rework only a single component we are having a genrad rework station to do these things
Electronics Forum | Thu Sep 03 01:17:23 EDT 2009 | isd_jwendell
Because it's always the same terminal of the same part that is affected, and the same component is placed in multiple locations on the board without problems, I would suspect the board itself.
Electronics Forum | Fri Aug 23 02:29:16 EDT 2019 | sssamw
It seems because the soldering area is not enough, so the wetting force is small to hold the switch, remember >0.08g/mm2 for each part as in IPC standard. So, anyway, you need increase the soldering area to reduce weight/area number to below 0.08g
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