Electronics Forum | Thu Jun 13 06:08:57 EDT 2002 | edahi
guys thanks for the suggestions... DaveF, *Changing paste EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current
Electronics Forum | Wed Jun 12 08:24:03 EDT 2002 | davef
Tough. 0402 capacitors are more prone to tomb stoning than resistors. Tailor your process to the 0402 and let the other stuff fall where it falls. Search the fine SMTnet archives for discussion on tomb stoning. Consider: * Changing paste. * Apply
Electronics Forum | Thu Jun 13 11:27:25 EDT 2002 | davef
>*Changing paste >EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current application naturally is stencil printing.
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Wed Mar 05 11:45:04 EST 2003 | msivigny
Hello Yngwie, When we look at the technical benefits of using N2, you'll find that your customer is trying to get a better product. Now as we discuss just a few of the reasons to use N2, when O2 is present in the heating atmosphere it carries oxides
Electronics Forum | Wed Mar 05 08:12:56 EST 2003 | nifhail
Hi Mike, How do we measure the O2 ppm in N2 environment. I don't understand why the customer keep insisting me to use N2 instead of Air. I don't see the need for it as I done have any soldering issue. Can you share with me why N2 is needed at the fi
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
Electronics Forum | Thu Aug 01 12:55:41 EDT 2002 | johnw
we run the paste in both air and n2 depending on customer requirements again it run's fairly well in both. Some people say it's better sme say it doesn't make a bit of difference, I'm somewhere in between at the moment. I definately think there's imp
Electronics Forum | Thu Jan 06 15:51:08 EST 2011 | flipit
Nitrogen increase surface tension in solder. This also reduces solder balls.
Electronics Forum | Tue Sep 22 12:58:18 EDT 1998 | Chyrs
| How can I solve the small solder ball in the N2 W/S ? | The Oxygen level is 10000~20000ppm & no-clean flux. Yuen, Sorry I an't got an answer, just more questions. 1-2% O2 in your wave solder - are you running membrane generated nitrogen? I don't
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