Electronics Forum | Thu Feb 21 21:50:38 EST 2002 | dougk
Silly question, but, are TR blades 'exactly' the same size as MPM's and seat themselves in the holders just like MPM's? Also, different types of steel are harder (less flexable) than others. Are TR's the same? If harder (due to steel strength or coat
Electronics Forum | Mon Jan 21 12:06:47 EST 2008 | sliebl
As others have said, Bliss racks are not cheap, but they sure are nice. We are a small single shift shop, but we have 4 of their carts. Two for stencils and two for feeders. Even fully loaded these roll very nicely if you need to get them out of the
Electronics Forum | Thu Dec 24 13:43:30 EST 1998 | Earl Moon
| | | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. T
Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem
Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia
Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Wed Sep 06 18:19:37 EDT 2017 | slthomas
Hi All, We are being intermittently challenged by a .5mm pitch uBGA paste release issue. We don't build with many of these so don't have a lot of history here. We've gone through 3 different stencil designs and the most consistent performer was 4 m
Electronics Forum | Thu Dec 24 09:32:53 EST 1998 | Earl Moon
| Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The p
Electronics Forum | Thu Dec 24 13:29:19 EST 1998 | Chris Grendler
| | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The
Electronics Forum | Tue May 28 09:27:04 EDT 2002 | pjc
Does this PBGA have eutectic balls? If so and the PCB is HASL finish, or has solder on the lands from BGA removal, you may not have to apply solderpaste. Check with you flux supplier to see if they offer a NC "flux paste" product, otherwise I know Mu
Electronics Forum | Tue Sep 14 14:07:45 EDT 2010 | grahamcooper22
Hi Gani, HASL is normally very good for solderability providing there is a good consistent coating of HASL on the pcb pad. But it is not unusual to have a very thin coating of HASL on the pad and this is poor for solderability. You then have tin/copp
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