Electronics Forum | Wed Feb 23 21:35:01 EST 2000 | Dave F
Larry: You're correct to question this: * We don't like to run raw paste through our aqueous cleaner. It makes a blinking mess. Your entire machine is probably now coated with hazardous material ... well at least the first tank and the out-bound
Electronics Forum | Wed May 31 23:19:15 EDT 2000 | Jackie Hsieh
I think the reasons of the tombstone phenomenon could be concluded as follows: 1.The proper pad size,including the dimension of two pads,the gap of two pads. 2.The temperature distribution must be uniform (take care the shadow-effect) 3.The ramp-up s
Electronics Forum | Wed Feb 23 21:35:01 EST 2000 | Dave F
Larry: You're correct to question this: * We don't like to run raw paste through our aqueous cleaner. It makes a blinking mess. Your entire machine is probably now coated with hazardous material ... well at least the first tank and the out-bound
Electronics Forum | Thu Aug 27 11:08:30 EDT 1998 | Richard Scarcelli
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Fri Aug 28 12:49:24 EDT 1998 | Earl Moon
| | | Would like to know the following information on processing micro bga's: | | 1) Fine mesh solder paste .vs. tacky flux --- which is best | | 2) Stencil thickness for solder screen | | 3) Aperature size for standard pitch balls | | 4) Which
Electronics Forum | Tue Sep 14 02:46:17 EDT 2010 | grahamcooper22
Hi Gani, Looking at the pictures in the report it looks as if there is a thin coating of solder on the pcb pad....but it looks like the BGA sphere was barely in contact with the pad. This could be caused by insufficient solder paste on this pad...may
Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish
Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the
Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
Electronics Forum | Wed Jul 15 03:20:51 EDT 2020 | wellmanrau
Dear Sir: We have the coating machine with good performance and price for market promotion. We have been producing the SMT machines and intelligent equipment for many years, integrated Design, R&D, Production, Sales and Technical Service. What produc
Electronics Forum | Mon Mar 02 00:38:35 EST 2009 | sachu_70
Hi Jorge, The success of such production purely depends on process control. One needs to first understand the board layout in detail, and evaluate any critical components for their temperature handling capabilities. Remember, you are dealing with com
