Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef
First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate
Electronics Forum | Thu Aug 26 14:45:09 EDT 1999 | Earl Moon
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup
Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the
Electronics Forum | Wed Sep 02 16:37:18 EDT 1998 | SMT-ASSY
We sent you our brochures through your Email address. SMT-ASSY Electronique Inc. offers training to operators, technicians, engineers or any other individuals that requires hands on training on hand soldering, board rework and the surface mount tech
Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef
That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl
Electronics Forum | Thu Jun 06 09:45:14 EDT 2002 | Hussman69
We based ours on the type of paste we use (stencil life) and not so much the machine. Then we coupled that to what 'true' conditions we normally see in our plant, and determined that under these conditions Max & min) our printing process should be g
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Thu Nov 03 14:23:58 EST 2005 | Samir Nagheenanajar
Thank you for the advice. I am not so concerned with the "2nd reflow", as the same can be said for double sided reflowed PCBA's (the bottom-side parts essentially go through a 2nd reflow). As for the HASL, there is a formula in calculating how much
Electronics Forum | Sat Aug 11 05:29:31 EDT 2007 | johnz
We are having a problem with JST connector ICM-MA50H-SS52-1161 LF SN. After reflow oven soldering we have mostly problem with soldering quality for firs or last leg of the connector. (There is no connection- leg just lays-lift on the solder no wicki
Electronics Forum | Wed Jul 15 03:17:47 EDT 2020 | wellmanrau
We have been producing the SMT machines and intelligent equipment for many years, integrated Design, R&D, Production, Sales and Technical Service. What products we manufactured are: SMT Printer/Stencil Printer/Solder Paste Printer, Pick and Place Mac
