Electronics Forum: nano coating stencil (Page 10 of 17)

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice

I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work

64 pin 10mm QFP w/ 0.5mm lead pitch & E3 Coating

Electronics Forum | Wed Aug 21 20:11:34 EDT 2002 | mitch

We are going to begin using a 64 pin 10mm QFP with 0.5mm lead pitch. I was recently asked if we need to purchase our PCB with E3 coating instead of tinned pads when using the .5 pitch. The concept being suggested is that the E3 coating will give us b

Conformal Coat

Electronics Forum | Thu May 26 09:54:49 EDT 2016 | swag

Not exactly SMT but something I recently did that might save you lots of time and money: Complex high $ assy that has 25+ conformal coat keep out areas - most different shapes. All locations are dimensioned on customers' print. We tried a one piec

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

Micro-BGA Process

Electronics Forum | Tue Aug 25 09:29:59 EDT 1998 | Richard Scarcelli

Would like to know the following information on processing micro bga's: 1) Fine mesh solder paste .vs. tacky flux --- which is best 2) Stencil thickness for solder screen 3) Aperature size for standard pitch balls 4) Which direction is the marke

Re: Micro-BGA Process

Electronics Forum | Fri Sep 11 10:52:25 EDT 1998 | Javier Carrera

| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is

BGA non wetting

Electronics Forum | Tue Sep 14 04:00:12 EDT 2010 | genesan

Hi Sir grahamcooper22, There should not a issue in stencil since i had open the aperature 1:1(one to one).Futhemore this is HASL pcb coating as now our customer had convert to immersion silver.I had do comparison between both and found HASL wetting n

Conformal Coat

Electronics Forum | Thu May 26 12:00:21 EDT 2016 | swag

Yes - the frame is built to nominal per print then the tape pieces are placed into areas in the frame as required. I had the stencil house cut #'s into the frames designating each different size. When I cut the tape pieces, I put them on a large, s

Flux dip or solder print for CSP

Electronics Forum | Tue Jan 31 09:41:06 EST 2017 | emeto

If there is no specific quality reason, stay with paste. More processes you add, more points of failure. They don't need a lot of paste to get attached to the board. The ones I used were 8mil round apertures, so I did cut 1:1 on a 3 mil coated stenci

PCBA Production Manufacturing Time Control

Electronics Forum | Mon Apr 18 12:08:18 EDT 2022 | proceng1

So you run one side, and leave the boards sit in temperature controlled environment for 3 days before running the other side? Are they ENIG coated? If so, they are probably ok. You could always keep the boards in your hot room. I assume this is du


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