Electronics Forum | Fri Jan 10 15:02:03 EST 2003 | John
Hi. I am familiar with the Transition blades. Normally, when there is metal to metal contact, as in the squeegee-stencil situation, there will be scratches, or a "brush pattern". Sometimes it takes the pattern of the high profile surface elements u
Electronics Forum | Thu Jul 21 19:53:20 EDT 2011 | isd_jwendell
Using AIM N.C. paste, just ran 10 panels to test after applying Rain-X to the stencil (pre-clean with IPA). Printing and release were slightly better (maybe my imagination), but not a large difference. Stencil remained cleaner longer. I could not tel
Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice
I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work
Electronics Forum | Thu Sep 07 11:24:21 EDT 2017 | slthomas
HI Tsvetan, Can you tell me what material your stencil was fabbed from? I have seen (from different suppliers) references to at least 3 different grain sizes of stainless for laser cut, plus electroformed nickel for laser cut, electroformed nickel,
Electronics Forum | Wed Aug 21 20:11:34 EDT 2002 | mitch
We are going to begin using a 64 pin 10mm QFP with 0.5mm lead pitch. I was recently asked if we need to purchase our PCB with E3 coating instead of tinned pads when using the .5 pitch. The concept being suggested is that the E3 coating will give us b
Electronics Forum | Thu May 26 09:54:49 EDT 2016 | swag
Not exactly SMT but something I recently did that might save you lots of time and money: Complex high $ assy that has 25+ conformal coat keep out areas - most different shapes. All locations are dimensioned on customers' print. We tried a one piec
Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Tue Aug 25 09:29:59 EDT 1998 | Richard Scarcelli
Would like to know the following information on processing micro bga's: 1) Fine mesh solder paste .vs. tacky flux --- which is best 2) Stencil thickness for solder screen 3) Aperature size for standard pitch balls 4) Which direction is the marke
Electronics Forum | Fri Sep 11 10:52:25 EDT 1998 | Javier Carrera
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Tue Sep 14 04:00:12 EDT 2010 | genesan
Hi Sir grahamcooper22, There should not a issue in stencil since i had open the aperature 1:1(one to one).Futhemore this is HASL pcb coating as now our customer had convert to immersion silver.I had do comparison between both and found HASL wetting n
