Electronics Forum: nano-protek stencil coating (Page 10 of 14)

Re: Solder Wetting

Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup

Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the

Re: SMT Training course

Electronics Forum | Wed Sep 02 16:37:18 EDT 1998 | SMT-ASSY

We sent you our brochures through your Email address. SMT-ASSY Electronique Inc. offers training to operators, technicians, engineers or any other individuals that requires hands on training on hand soldering, board rework and the surface mount tech

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef

That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl

environment Operational deg-C and RH% for Paste Printer

Electronics Forum | Thu Jun 06 09:45:14 EDT 2002 | Hussman69

We based ours on the type of paste we use (stencil life) and not so much the machine. Then we coupled that to what 'true' conditions we normally see in our plant, and determined that under these conditions Max & min) our printing process should be g

BGA Solderability Standard

Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com

USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R

Lead Based Paste / Lead-Free BGA

Electronics Forum | Thu Nov 03 14:23:58 EST 2005 | Samir Nagheenanajar

Thank you for the advice. I am not so concerned with the "2nd reflow", as the same can be said for double sided reflowed PCBA's (the bottom-side parts essentially go through a 2nd reflow). As for the HASL, there is a formula in calculating how much

CF CARD issue

Electronics Forum | Sat Aug 11 05:29:31 EDT 2007 | johnz

We are having a problem with JST connector ICM-MA50H-SS52-1161 LF SN. After reflow oven soldering we have mostly problem with soldering quality for firs or last leg of the connector. (There is no connection- leg just lays-lift on the solder no wicki

Nano coatings ?

Electronics Forum | Fri Feb 22 15:56:34 EST 2013 | davef

I don't know, what you have, but I just got back from the IPC APEX show and I'll make several points: * One take away about 'nano ...' is that it means different things to different people. For instance, in stencil printing: ** DEK uses Aculon and it

DEK conveyor belt

Electronics Forum | Wed Jul 15 03:17:47 EDT 2020 | wellmanrau

We have been producing the SMT machines and intelligent equipment for many years, integrated Design, R&D, Production, Sales and Technical Service. What products we manufactured are: SMT Printer/Stencil Printer/Solder Paste Printer, Pick and Place Mac

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple


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