Electronics Forum | Tue Jun 15 12:54:34 EDT 2004 | jsmith01
It seems like the break is happening between the sn and ni. The parts are dull in appearance will not take solder even with an iron after they come off so it leads me to believe that there is only ni left on the part. The parts are liquidous for ab
Electronics Forum | Thu Feb 18 17:49:28 EST 1999 | Ryan Jennens
Hey all- My question is this: My stencil printer operator has said that he has to wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch aperatures for a QFP to release well. We are using Amtech NC-559 type 3 paste with 89.5% metal
Electronics Forum | Fri Feb 19 13:54:22 EST 1999 | Tuffty
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Sat Feb 20 23:08:36 EST 1999 | GORDON DURPHEY
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Tue Feb 23 09:51:35 EST 1999 | Steve Schrader
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Mon Feb 22 14:21:14 EST 1999 | Rick Wyman
| | Hey all- | | | | My question is this: My stencil printer operator has said that he has to | | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 |
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