Electronics Forum | Wed May 27 15:00:32 EDT 1998 | Scott Cook
| The question raised by our components engineering group is, is it possible to tell whether these failures are thermally or mechanically induced. The focus of design engineering up until now has been on process. Are our reflow temps ok, are the pa
Electronics Forum | Wed May 05 10:57:25 EDT 1999 | Kevin Hussey
| | | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | | | My question's are really : | |
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