Electronics Forum | Sat Sep 05 16:09:10 EDT 2015 | emanuel
Need assistance - I want to disconnect an unused LCS module from an Emerald machine. I disabled the tray changer and buffer conveyor in the machine's configuration but I still get an L212 error on the bottom of the screen and the machine hangs during
Electronics Forum | Mon Mar 02 21:54:10 EST 1998 | MONICA PARK
| Is there any publication or web-site where I can find out more information on the manufacturers of SMT and through hole equipment, the size of the market place, and the typical values of equipment? Dear. Sir. We are so pleased to contact with you
Electronics Forum | Mon Mar 02 21:57:35 EST 1998 | MONICA PARK
| | Is there any publication or web-site where I can find out more information on the manufacturers of SMT and through hole equipment, the size of the market place, and the typical values of equipment? | Dear. Sir. | We are so pleased to contact wit
Electronics Forum | Fri May 09 14:29:35 EDT 2008 | charliedci
We purchased a Promation 2 meter, 2 stage conveyor 1 year ago, although it is not as robust as I would like, for connecting 2 Juki flexible mounters together in line (as a buffer) and to hand place some bulk components it works just fine. No one has
Electronics Forum | Sun Aug 18 06:23:34 EDT 2002 | bentzen
Hi Ken. It's always fun and a good exercise to debat on a interesting subject like this. I can see at your response that I have to clarify some of the issues. Yes, the placement machine should be the line bottleneck. And in a line with more placem
Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach
| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833
Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon
| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
Electronics Forum | Thu Oct 04 00:00:58 EDT 2018 | gaintstar
Flason SMT Reflow Ovens: http://www.flason-smt.com/product/China-Reflow-oven.html http://www.flason-smt.com/product/China-Samsung-EXCEN-PRO-High-Speed-SMT-Modular-Chip-Mounter-agent.html http://www.flason-smt.com/product/China-Samsung-SM321-High-Spe
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
