Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
Electronics Forum | Tue Jan 22 21:27:40 EST 2008 | davef
This is a picture of hypercorroded nickel [black pad]. We posted it as an attachment to the thread. It's a new feature that the folk at SMTnet.com added for our dancing and dining pleasure. Well, maybe not that, but we'll be able to communicate bette
Electronics Forum | Mon Oct 20 14:17:35 EDT 2008 | robinj
The discoloration/shadow appearance is a clear sign of black pad which is from nickel corrosion in the gold bath.
Electronics Forum | Mon Nov 03 11:20:08 EST 2008 | boardhouse
Vlad, That was a bad statement to make... Enig should never be thicker than 5 micro inches max. or it will cause embrittlement. This process does self limit but it can put on as much as 10-14 Micro inches which would be a major cause of concern.
Electronics Forum | Thu Jan 22 20:14:44 EST 2009 | herman
If you wish to specify ENIG, your best method of doing it is to simply invoke IPC-4552 (or IPC-4553 for immersion silver) on the fabrication drawing. These IPC standards define ENIG and IAg, and I believe they specify 150-180 uinches of nickel covere
Electronics Forum | Mon Oct 20 15:41:19 EDT 2008 | patrickbruneel
Josh, You can not check the bare boards for black pad unless you remove the gold plating. Like Robin said black pad is nickel oxidation/corrosion and a result from bad electroless nickel plating bath control. The only preventative action you take is
Electronics Forum | Thu Aug 23 09:52:38 EDT 2007 | d0min0
Hi, in past we had an issue with ENIG surface, black was Ni that get pass the Au - but it was discovered after reflow (SnPb) and the IC was losing contact with Cu tracks...at customers application :| Reason was as I remember too thin Au sufrace... w
Electronics Forum | Tue Oct 21 21:34:56 EDT 2014 | davef
"Electroless Nickel Immersion Gold and Black Tar. What Is It and How Can It Be Prevented?" James Trainor, OM Group Electronic Chemicals, LLC SMTAI 2014 SUB2
Electronics Forum | Thu Mar 02 07:40:46 EST 2000 | Roni Haviv
Allmost forgot: The "black pad" is simply the oxidized Nickel.
Electronics Forum | Thu Mar 02 07:40:46 EST 2000 | Roni Haviv
Allmost forgot: The "black pad" is simply the oxidized Nickel.
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