Electronics Forum | Thu Jul 15 06:27:50 EDT 2010 | xps
Hi after an enviromental test 85C/85RH, for 3 months (powered), of an electronic assembly with edge finger tabs ENIG finished (nickel 5micron, gold 0.02micron), the nickel disappears completely under the gold (due to corrosion, I think). Does anyone
Electronics Forum | Thu Jul 15 13:27:42 EDT 2010 | xps
Thanks... anyway I confirm, the nickel disappear (verified by cross section)and a strange substance greyish above gold, covering the tabs after test. I don't know the reason for this phenomenon. I don't believe that with proper electrolytic nickel fi
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers
I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv
Electronics Forum | Wed May 11 13:27:30 EDT 2005 | Sam Ho
i want to know which type of solder paste and reflow profile can support the solder pad with nickel but not covered gold on the pcb.
Electronics Forum | Thu Oct 30 18:10:19 EDT 2014 | hegemon
Rather than asking why, maybe the better response is to reject the PWBs and have them re-fabricated correctly? Of course circular reasoning tells me that the reason for your issues is that you have 3x the amount of nickel beneath the gold. I wish I
Electronics Forum | Mon Oct 27 20:01:00 EDT 2014 | rangarajd
Hello, We are facing solderability issues on a particular lot of board. THe Nickel thickness measured with an XRF is around 400 U inches. Spec calls out for 130 u inches Nickel and 3 - 5 U inches gold over it. Assuming there is no porosity on the g
Electronics Forum | Wed Aug 11 16:09:50 EDT 2004 | Kris
Hi How does one distinquish between hard gold and immersion gold ? thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel what happens if the gold drops below 3" and the nickel is above 350" what are the typical failure modes associated with
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
