Electronics Forum | Mon Aug 03 04:51:58 EDT 2009 | lococost
From alpha metals lead free alloy impurities bulletin: "Levels greater than 0.025% may start to slow the wetting speed and could affect the hole fill performance. If process performance is OK then levels up to 0.05% are OK."
Electronics Forum | Wed Jul 06 13:06:22 EDT 2005 | patrickbruneel
Dave, Great to see you more involved in the lead-free. I assume the tests you have done were in lab environment, would it be possible to explain how you measured the area reduction (loss of weight or reduction of diameter/thickness) and how did you
Electronics Forum | Sat Jan 06 10:27:07 EST 2001 | Dave F
This is a very timely topic, as we drift [buffeted by the combined wind of everyone down-stream in the supply chain ] on waves carrying all of us from the land of lead to the land of no-lead. I want to say there was a recent trade journal article pu
Electronics Forum | Sat Sep 18 13:05:57 EDT 1999 | Brian
| | | | | | Dave, I'll respond by paragraph: | | | | | | | Brian: | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slath
Electronics Forum | Sat Sep 18 14:37:00 EDT 1999 | Earl Moon
| | | | | | | | | Dave, I'll respond by paragraph: | | | | | | | | | Brian: | | | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like
Electronics Forum | Sat Sep 18 12:27:21 EDT 1999 | Earl Moon
| | | Dave, I'll respond by paragraph: | | | | | Brian: | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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