Electronics Forum | Fri Jul 13 14:56:01 EDT 2001 | stevenamacdonald
One of our board vendors recently switched their stencil design to home plate apertures. Since the change the quality and yield of their PCB's has went south, Could this process change be the cause?
Electronics Forum | Fri Jul 13 19:08:55 EDT 2001 | mparker
Home plate apertures are designed to reduce or eliminate solder balls that occur when placing a chip and reflow of the solder. This aperture type is usually desired when processing with a "no-clean" solder paste. The design of the aperture is usually
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Tue Apr 17 17:30:09 EDT 2007 | jaimebc
Our experience with leaded paste and SAC305, for 0402's, has been positive with the following stencil designs: 1.- 5 mil thickness. 2.- Home plate design. Hope it helps.
Electronics Forum | Sat May 27 12:50:21 EDT 2000 | Micah Newcomb
Steve, I use homebase apertures as a standard for all chip parts and have no complaints, no solder beading, no issues. I have had to replace almost all stencils ordered previous to my arrival as they all caused defects (7-9mil thickness and 1:1
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Wed Jun 22 18:52:56 EDT 2011 | semiconjt
tTo explain what I mean...sorry for my bad Engilsh... please find short " patchwork stencil" description from EPP Europe. http://www.epp-online.de/europe/-/article/16537487/15944614/Innovators-of-laser-processing-technology /art_co_INSTANCE_0000/max
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Wed Feb 22 10:00:58 EST 2006 | dougs
We've just set up a couple of products with 0.5mm pitch uBGA devices on them, i went for 5thou thick, laser cut nickel (to aid paste release) square pads same size as the diameter of the uBGA pads. Or you could go to a 4 thou nickel stencil, better
Electronics Forum | Sun Dec 08 23:40:19 EST 2002 | nonotalent
Hi all, We are currently having problems with > a laser-cut stencil that is electropolished and > nickel plated with 9-mil openings. The paste > does not release well from the apertures. We are > having to wipe after every print. The board is >
