Electronics Forum | Mon Aug 09 20:47:21 EDT 2004 | KEN
I think OA flux left on the pot would quickly looses its activity and become part of the dross waste stream, and smoke stream for that matter. Also, if your wave is setup properly your selective pallets will scour (push) the top of the lambda wav
Electronics Forum | Mon Aug 09 11:34:25 EDT 2004 | Woodsmt
I am looking for data / info on how flux may contaminate the solder in a Wave. I have a customer who requires a no clean process. Our wave is equipped with 2 separate fluxing systems and I would like to use OA in one and the No Clean in the other. Th
Electronics Forum | Wed Aug 18 15:43:06 EDT 2004 | Woodsmt
Ken, Thanks for your reply. It seems in line with all my other Inquires.
Electronics Forum | Thu Mar 31 13:48:19 EST 2005 | shannond
Hi All, I have to solder a device with platinum clad nickel leads to a PCB. I am having a hard time getting solder to flow on to the leads. Are there special proceedures that I need to follow because of the platinum or am I just dealing with contamin
Electronics Forum | Thu Mar 31 19:52:50 EST 2005 | davef
We agree with Russ that you're talking palladium instead of platinum. Your wetting problem likely is not the Pd-Ag surface layers, but the underlying metal or nickel to which you need to wet. Either a base metal is: * Contaminated and poorly wettabl
Electronics Forum | Wed Mar 12 16:30:45 EDT 2008 | operator
I witnessed this at our sister company. It seems to be their standard process. It is not my place to interfere with their processes. I was just curious if there was any chance of brittle solder joints or other defects that might be caused from the WS
Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator
I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.
Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef
Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra
Electronics Forum | Wed Aug 22 21:42:54 EDT 2007 | davef
Questions are: * Do these pads take solder? How well? * Have you stripped the gold and evaluated the condition of the nickel?
Electronics Forum | Thu Aug 23 09:52:38 EDT 2007 | d0min0
Hi, in past we had an issue with ENIG surface, black was Ni that get pass the Au - but it was discovered after reflow (SnPb) and the IC was losing contact with Cu tracks...at customers application :| Reason was as I remember too thin Au sufrace... w
