nickel reaction to batch cleaning products, companies, forum discussions and technical articles 2 nickel reaction to batch cleaning results

Electronics Forum: nickel reaction to batch cleaning (Page 1 of 1)

Re: Noclean soldering to gold

Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May

Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881

PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro

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