Electronics Forum | Mon Feb 14 12:19:32 EST 2000 | Dave F
Dean: I associate black plague as an immersion gold process problem (although I could easily be wrong): Everybody looks at the nickel, but the cause turns out to be the immersion gold is too aggressive. The immersion gold works by corroding the nic
Electronics Forum | Wed Sep 10 14:14:03 EDT 2008 | gregoryyork
Yes why did the Electroless Nickel layer split this is the ROOT cause. My guess is still that the resist was slightly miss registered over the copper and therefore poor adhesion of the Nickel ensued OR like I said originally the resist had contaminat
Electronics Forum | Sun Sep 07 17:16:57 EDT 2008 | gregoryyork
OK Pizza it is then, here goes. Dewetting of Ni/Au pads, paste favouring the Tinned component lead hence excess paste wicking on top of the components. Reason is EITHER Nickel migration into the gold due to high levels of Ionics from poor rinse OR mo
Electronics Forum | Fri May 07 00:52:24 EDT 2010 | boardhouse
Hi Derek, just curious of one thing - are the vias within the BGA's the only vias covered or are all vias on the board covered. Just trying to figure out what is making this area different from the rest of the board. Regarding leaching, I do not be
Electronics Forum | Wed Feb 09 22:08:45 EST 2000 | Dave F
Russ: You've got stop soft-peddling this stuff. This doesn't sound like "poor solderability." It sounds like "no solderability." It also sounds like you�re dead meat. Three places to call: 1 Board supplier to get their suggestions on unsolderab
Electronics Forum | Thu Aug 28 11:15:05 EDT 2008 | omid_juve
I've been there. Soldering no lead parts in a > leaded world can be difficult. Sounds like you > are not wetting to your parts becasue you ar enot > getting hot enough. Here's the trick - you can > turn up your profile to look like a no-lead
Electronics Forum | Thu Aug 28 07:32:06 EDT 2008 | realchunks
I've been there. Soldering no lead parts in a leaded world can be difficult. Sounds like you are not wetting to your parts becasue you ar enot getting hot enough. Here's the trick - you can turn up your profile to look like a no-lead profile, and
Electronics Forum | Thu Feb 10 22:41:20 EST 2000 | Dave F
Russ: Now that�s a good story. Nuff said on the Vegas trip, that explains everything. Especially when you say "it must have something to do with ..." I love WS609. It�s been berry, berry good to me. Intermetalic Layer (IL). A compound formed a
Electronics Forum | Thu Feb 10 10:28:56 EST 2000 | Russ
Okay, Okay, here is the rest of the story! These boards were definitely plated, reworked to HASL, The component that is the most succeptable is a 160 pin QFP .5mm pitch. This component has nickel/iron lead frame. Significantly reduced apertures (1
Electronics Forum | Tue Aug 30 09:24:08 EDT 2005 | Slaine
we manufacture a range of ceramic parts that have silver termination,there is already a small leaching problem (absorption of the termination by the solder in liquid form)with Sn62 that we live with, having to implement unleaded solder they are norma
