Electronics Forum | Thu Jul 27 07:50:35 EDT 2006 | davef
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Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Thu Dec 09 23:57:41 EST 1999 | Jeff Sanchez
Mike, A drag solder system is not so bad. If it's not discoloring the silk screen , damaging your parts or blistering your boards than it looks like a safe bet. I am not sure what other components you have on the boards besides the LED's? But the
Electronics Forum | Wed Jun 22 15:03:12 EDT 2005 | patrickbruneel
The only thing ammonia can do is tarnish copper and make it more difficult to solder. And the higher temp in lead-free will discolor the latex (giving it a sticky surface), but the functionality of the mask will be intact. There should be greater co
Electronics Forum | Mon Jan 17 09:02:27 EST 2005 | russ
I have found that with the TI ni/pd platings that a peak temp of 226 C is the best for joint strength. Russ
Electronics Forum | Sun Oct 13 08:53:46 EDT 2002 | greenman
TI found an improvement in solderability on their Ni/Pd lead-finishes by using inert (nitrogen) reflow, but this is an expensive operation for just one part.
Electronics Forum | Fri Oct 01 10:00:10 EDT 2010 | 18424
We currently use and have used Aim W/S 483 for the past ten years. We have had great support from AIM. Paste Characteristics, wetting, slump, washing is all outstanding. Great activity, works well with NiPd and other lead frames.
Electronics Forum | Tue Dec 06 14:30:49 EST 2005 | Samir Nagaheenanajar
I agree with Ken!! Amen to that, brother! At my company here in Rihad, our design guys are in a tizzy about lead free components and tin whiskers, and with every questionable through-hole solder joint, or when our purchasing department gets "notif
Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef
Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,
Electronics Forum | Mon Mar 07 15:35:35 EST 2005 | John M
It has been my experience that the standard Fr4 material (Tg 135c) will discolor when processed at the new higher temperatures required for the high tin alloys... We have been using the High Tg Fr4 (Tg 170c) for many years to ensure this does not hap
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