Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Wed Sep 22 15:33:54 EDT 2010 | davef
Comments are: * First, no one is looking at your posting. You need to post in the 'SMTnet Production Forum' [top of the page]. This 'SMTnet Site Support Forum' is for whiners that want to complain to Neil about problems in logging-in, font that's to
Electronics Forum | Wed Mar 14 10:42:20 EDT 2018 | jon_roberts
Dave, thanks. I was going to change Cu/PD/Au to Ni/Pd/Au and then my question is: Has anyone had soldering issue with components (ICs) with the above finish during reflow and/or had to change the oven profile to improve the wetting. Sorry for confusi
Electronics Forum | Thu Sep 18 23:56:56 EDT 2008 | trynders
am having wetting issues with two Burr Brown Op amps. Both are SOICs with NiPdAu lead frame finishes. I have attached a photo that shows a black streak the length of the lead (before soldering). This appearance is consistent of all leads and is exist
Electronics Forum | Fri Sep 19 21:31:15 EDT 2008 | trynders
Thanks for the response guys! The parts are being sent to a local lab as we speak. I'll let you know the results when I get them. I am not sure the purpose of the copper band, but the black around the band is just shadowing from how I took the pi
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